xSPI Multiple Bus Memory Controller (xSPI-MBMC) IP v3

for HyperBus™ 1.0 and 2.0, OctaBus™, Xccela® Bus, 

JEDEC® xSPI (JESD251) Profile 1.0 and Profile 2.0, …

Memory device support​

SLL Partners and Supported FPGA and Memory Vendors

xSPI MBMC v3 support for memory devices

SLL’s xSPI MBMC IP supports, and is physically qualified with, the broadest range of JEDEC xSPI Profile 1.0 and 2.0 and xSPI-like memory device variants in the market.
  • Supports PSRAM (low power replacement for SDR, LPDDRx, DDRx, DDRxL SDRAM)
  • Supports NOR Flash (for fast random read access and long term data retention)
  • Support for NAND Flash coming soon (for low-cost per bit and largest storage capacities)
  • Supports memory devices with x4, x8 and x16 data paths
  • Supports any combination of 2 memory devices (with same data path width) on shared pins
  • Use of selected x8 NOR Flash devices for power on configuration of Intel Cyclone 10 LP in 1S-1S-1s mode, and high speed re-use of that memory device in 8D-8D-8D
SLL’s xSPI MBMC IP supports the broadest range of memory vendors:
  • Ensures both short term and long term availability of memory devices for your project
  • The ability to source memory devices, from all major memory vendors, reduces your supply chain risk
xSPI MBMC IP currently supports, or will very soon support: xSPI MBMC IP enables easy transition from HyperBus™ 1.0 to HyperBus™ 2.0. SLL’s HyperBus™ 1.0 customers are already successfully employing 200 MHz HyperBus™ 2.0 devices at up to 200 MHz DDR in FPGA.

xSPI MBMC v3 support for AP Memory Xccela PSRAM

Status of AP Memory Xccela PSRAM device testing and qualification performed by SLL:

  • AP Memory – Xccela PSRAM:
    • Physically validated:
      • APS1604M-DQRABA (x4, 16 Mbit, 1.8V)
      • APS6408L‐OBx  (x4, 64 Mbit, 1.8V)
      • APS12808L-OBx (x8, 128 Mbit, 1.8V)
    • Validation in process on Trenz board:
      • APS1604M-DQRABA (x4, 16 Mbit, 1.8V)
      • APS12808L-OBM-BA (x8, 128 Mbit, 1.8V)
      • APS12808L-3OBM-BA (x8, 128 Mbit, 3V)
      • APS25608N-OBR-BD (x8, 256 Mbit, 1.8V)
      • APS256XXN-OBR-BG (x8, 256 Mbit, 1.8V)
      • APS256XXN-OBR-BG (x16, 256 Mbit, 1.8V)
      • APS51208N-OBR-BD (x8, 512 Mbit, 1.8V)
    • Validated in simulator:
      • APS3208L-OBx (x8, 32 Mbit, 1.8V)
      • APS3208L-3OBx (x8, 32 Mbit, 3V)
      • APS6408L-3OBx (x8, 64 Mbit, 3V)
      • APS12808L-3OB (x8, 128 Mbit, 3V)
      • APS25608N-OBRx  (x8, 256 Mbit, 1.8V)
      • APS51208N-OBRx (x8, 512 Mbit, 1.8V)

xSPI MBMC v3 support for AP Memory OctaRAM

Status of AP Memory OctaRAM device testing and qualification performed by SLL:

  • AP Memory – OctaRAM:
    • Physically validated:
      • APM6408L-OC (64 Mbit, 1.8V)
      • APM6408L-3OC (64 Mbit, 3.0V)
    • Support planned:
      • APS25608N‐OCx (256 Mbit, 1.8V)
      • APS51208N‐OCx (512 Mbit, 1.8V)

xSPI MBMC v3 support for Dialog Semiconductor Octal xSPI

Status of Dialog Semiconductor ® Octal xSPI Memory (EcoXIP) device testing and qualification performed by SLL:

xSPI MBMC v3 support for Everspin SPI Industrial STT-MRAM

Status of Everspin®  EM064LX  SPI Industrial STT-MRAM Persistent Memory:

  • Validation in simulation – Pending
  • Validation in hardware – Pending

xSPI MBMC v3 support for Gigadevice

Status of Gigadevice® NOR Flash (GD25XGD25LX) device testing and qualification performed by SLL:

  • Gigadevice® – NOR Flash (GD25XGD25LX) :
    • Validation in process on Trenz board:
      • GD25LX256EBIR          (x8, 256 Mbit, 1.8V)
      • GD25LX512MEBIRR    (x8, 512 Mbit, 1.8V)
      • GD55LX01GEBIRY       (x8, 1024 Mbit, 1.8V)

xSPI MBMC v3 support for Cypress / Infineon HyperFlash 1.0

Status of Cypress HyperFlash 1.0 device testing and qualification performed by SLL:

  • Cypress Semiconductor Corporation  – HyperFlash 1.0
    • Physically validated:
      • S26KS512SDPBHI020 / 6KS512SDPHIO2 (512 Mbit, 1.8V)
    • Validated in the simulator:
      • S26KS128S (128 Mbit, 1.8V)
      • S26KL128S (128 Mbit, 3.0V)
      • S26KL256S (256 Mbit, 1.8V)
      • S26KL512S (256 Mbit, 3.0V)
      • S26KS256S (512 Mbit, 1.8V)
      • S26KS512S (512 Mbit, 3.0V)

xSPI MBMC v3 support for Cypress / Infineon HyperRAM 1.0

Status of Cypress HyperRAM 1.0 device testing and qualification performed by SLL: 

  • Cypress Semiconductor Corporation –  HyperRAM 1.0
    • Physically validated:
    • Validated in simulator:
      • S27KS0641 (  64 Mbit, 1.8V)
      • S27KL0641 (  64 Mbit, 3.0V)
      • S70KS1281 (128 Mbit, 1.8V)

xSPI MBMC v3 support for Cypress / Infineon HyperMCP 1.0

HyperMCP (Hyper Multiple Chip Package) devices embed a HyperRAM 1.0 die and HyperFlash 1.0 die in the same BGA24 package to reduce board area.   

Status of Cypress HyperMCP 1.0 device testing and qualification performed by SLL:

xSPI MBMC v3 support for Cypress / Infineon SemperFlash with HyperBus Interface (HyperFlash 2.0)

Status of Infineon SemperFlash memory device testing and qualification performed by SLL:

  • Cypress Semiconductor Corporation – Semper Flash with HyperBus Interface (HyperFlash 2.0)
    • Physically validated:
      • S26HS512TGABHI00 /  26HS512TAI00 (512 Megabit, 1.8V)
    • Physical validation in process
      • S26HL512TFPBHI01  / 26HL512TPIO1 (512 Megabit 3.0V)
    • Physical validation in process on Trenz board:
      • S26HL512TFPBHM010      (512 Megabit, 3V)
      • S26HL01GTFPBHI030       (1 Gigabit, 3V)
      • S26HS01GTGABHV030    (1 Gigabit, 1.8V)
    • Physical qualification available on customer demand
      • S26HS01GT (1 Gigabit, 1.8V)
      • S26HL01GT (1 Gigabit, 3.0V)

xSPI MBMC v3 support for Cypress / Infineon SemperFlash with Octal Interface

Status of Infineon SemperFlash memory device testing and qualification performed by SLL:

  • Cypress Semiconductor Corporation – Semper Flash with Octal Interface

    • Physically validated:
      • S26HS512TGABHI00 /  26HS512TAI00 (512 Megabit, 1.8V)
    • Physical validation in process
      • S26HL512TFPBHI01  / 26HL512TPIO1 (512 Megabit 3.0V)
    • Physical validation in process on Trenz Board:
      • S28HS512TGABHB010  (512 Mbit, 1.8V)
      • S28HL01GTFPBHV030 ( 1 Gigabit, 3V)
      • S28HS01GTFPBHI030  ( 1 Gigabit, 1.8V)
    • Physical qualification available on customer demand
      • S26HS01GT (1 Gigabit, 1.8V)
      • S26HL01GT (1 Gigabit, 3.0V)

xSPI MBMC v3 support for Cypress / Infineon HyperRAM 2.0 with HyperBus Interface

Status of Cypress HyperRAM 2.0 memory device testing and qualification performed by SLL: 

  • Cypress Semiconductor Corporation – HyperRAM 2.0 with HyperBus Interface
    • Physically validated:
      • S27KS0642GABHI02  ES /  7KS0642GAHIO2  ES (   64 Mbit, 1.8V)
      • S70KS1282GABHI02  ES /  7KS1282GAHV02  ES (128 Mbit, 1.8V)
    • Physical validation in process on Trenz board:
      • S70KL1282GABHV020 (128 Mbit, 3V)
      • S70KS1282GABHV020 (128 Mbit, 1.8V)
    • Validated in simulator:
      • Pending..

xSPI MBMC v3 support for Cypress / Infineon HyperRAM 2.0 with Octal Interface

Status of Cypress HyperRAM 2.0 memory device testing and qualification performed by SLL: 

  • Cypress Semiconductor Corporation – HyperRAM 2.0 with Octal Interface
    • Physically validated:
      • Pending..
    • Physical validation in process on Trenz board:
      • S27KS0643GABHI020  (  64 Mbit, 1.8V)
      • S70KL1283GABHV020  (128 Mbit, 3V)
      • S27KL128DPBHV020    (128 Mbit, 3V)
    • Validated in simulator:
      • Pending..

xSPI MBMC v3 support for ISSI HyperFlash 1.0

Status of ISSI HyperFlash 1.0 device testing and qualification performed by SLL:

xSPI MBMC v3 support for ISSI HyperRAM 1.0

Status of ISSI HyperRAM 1.0 memory device testing and qualification performed by SLL:

  • Integrated Silicon Solution Inc. (ISSI) –  HyperRAM 1.0
    • Physically validated:
      • IS66WVH8M8ALL-166 (64 Mbit, single die, 1.8V)
      • IS66WVH8M8DALL-100 (64 Mbit, single die 3.0V)
    • Physical validation in process on Trenz board:
      • IS66WVH16M8DALL-166B1LI (128 Mbit, single die, 1.8V)
      • IS66WVH16M8DBLL-100B1LI (128 Megabit, single die, 3.0V)
      • IS66WVH32M8DALL-166B1LI (256 Megabit, single die, 1.8V)
      • IS66WVH32M8DBLL-100B1LI (256 Megabit, single die, 3.0V)
    • Provisional support available on customer demand
      • IS66WVH16M8EDALL  (128 Megabit, single die, 1.8V, Internal ECC)
      • IS66WVH16M8EDBLL  (128 Megabit, single die, 3.0V, Internal ECC)
      • IS67WVH8M8DALL       (   64 Megabit, single die, 1.8V)
      • IS67WVH8M8DBLL       (   64 Megabit, single die, 3.0V)
      • IS67WVH16M8DALL     (128 Megabit, single die, 1.8V)
      • IS67WVH16M8DBLL     (128 Megabit, single die, 3.0V)
      • IS67WVH32M8DBLL     (256 Megabit, single die, 3.0V)
      • IS67WVH16M8EDALL  (128 Megabit, single die, 1.8V, Internal ECC)
      • IS67WVH16M8EDBLL  (128 Megabit, single die, 3.0V, Internal ECC)
    • Unsupported devices
      • IS66WVH8M8ALL/BLL (SLL recommends all customers migrate to the supported newer single die IS66WVH8M8DALL/BLL)
        • IS66WVH16M8ALL-166  (128 Mbit, dual die, 1.8V)
          • ISSI 1643 IS66WVH16M8ALL-166B1LI  N508  BNB589580YC
          • ISSI 1806 IS66WVH16M8ALL-166B1L1 N508  BNN984000Y3
          • ISSI 1938 IS66WVH16M8ALL-166B1LI  N508  BNN984000Y3
          • ISSI 1938 IS66WVH16M8ALL-166B1LI  N508  BRN572000Y1
        • IS66WVH16M8BLL-100  (128 Mbit, dual die, 3.0V)
      • IS67WVH8M8ALL/BLL (SLL recommends all customers migrate to the supported newer single die IS67WVH8M8DALL/BLL)
        • IS67WVH16M8ALL-166  (128 Mbit, dual die, 1.8V)
        • IS67WVH16M8BLL-100  (128 Mbit, dual die, 3.0V)

xSPI MBMC v3 support for ISSI Octal Flash

Status of ISSI Octal Flash device testing and qualification performed by SLL:

  • Integrated Silicon Solution Inc. (ISSI) –  Octal Flash
    • Physical validation in process on Trenz board:
      • IS25LX256-JHLE (256 Mbit, 3V)
      • IS25WX256-JHLE (256 Mbit, 1.8V)
      • IS72WVO32M8AWO256-200HLA2 (256 Mbit OctaFlash, 64 Mbit OctalRAM, 1.8V)(
      • IS72WVO32M8BLO256-133HLA2 (256 Mbit OctaFlash, 64 Mbit OctalRAM, 3V)
    • Support planned:
      • IS25LX064
      • IS25WX064
      • IS25LX128
      • IS25WX128
      • IS25WX256
      • IS25LX512M
      • IS25WX512M

xSPI MBMC v3 support for ISSI Octal RAM

Status of ISSI OctalRAM device testing and qualification performed by SLL:

  • Integrated Silicon Solution Inc. (ISSI) –  OctalRAM:
    • Physical validation in process on Trenz board:
      • IS66WVO16M8DALL-200BLI    (128 Mbit, 1.8V)
      • IS66WVO16M8DBLL-100BLI     (128 Mbit, 3V)
      • IS66WVO16M8DBLL-133BLI     (128 Mbit, 3V)
      • IS66WVO16M8EDALL-166BLI  (128 Mbit, 1.8V, with ECC)
      • IS66WVO16M8EDBLL-133BLI  (128 Mbit, 3V, with ECC)
      • IS66WVO32M8DALL-200BLI    (256 Mbit, 1.8V)
      • IS66WVO32M8DBLL-133BLI    (256 Mbit, 3V)
      • IS72WVO32M8AWO256-200HLA2 (256 Mbit OctaFlash, 256 Mbit OctalRAM, 1.8V)
      • IS72WVO32M8BLO256-133HLA2 (256 Mbit OctaFlash, 256 Mbit OctalRAM, 3V)
    • Support planned:
      • IS67WVO16M8DALL
      • IS67WVO16M8DBLL
      • IS67WVO16M8EDALL (with ECC)
      • IS67WVO16M8EDBLL (with ECC)
      • IS67WVO32M8DALL
      • IS67WVO32M8DBLL

xSPI MBMC v3 support for ISSI Octal MCP

Status of ISSI OctalRAM device testing and qualification performed by SLL:

  • Integrated Silicon Solution Inc. (ISSI) –  Octal MCP:
    • Physical validation in process on Trenz board:
      • IS72WVO32M8AWO256-200HLA2 (256 Mbit OctaFlash, 256 Mbit OctalRAM, 1.8V)
      • IS72WVO32M8BLO256-133HLA2 (256 Mbit OctaFlash, 256 Mbit OctalRAM, 3V)

xSPI MBMC v3 support for JSC OctaRAM

Status of JSC OctaRAM device testing and qualification performed by SLL:

  • Jeju Semiconductor Corp (JSC) – OctaRAM:
    • Physically validated:
      • JSC28SSP8AGDY-50I (128 Mbit, 1.8V) 
      • JSC64SSP8AGDY-50I (64 Mbit, 1.8V)
    • Physical validation in process on Trenz board:
      • JSC28SSP8AGDY-50I (128 Mbit, 1.8V)
      • JSC64SSP8AGDY-50I (64 Mbit, 1.8V)
      • JSC64SSP8AGDY-75I (64 Mbit, 3V)
    • Validated in simulator:
      • JSC28SSU8AGDY-75I (128 Mbit, 3V)
      • JSC64SSU8AGDY-75I (64 Mbit, 3V)

xSPI MBMC v3 support for Macronix OctaFlash

Status of Macronix OctaFlash device testing and qualification performed by SLL:

  • Macronix International Co., Ltd – OctaFlash:
    • Physical validation in process on Trenz board:
      • MX25LM51245GXDI00  (512 Mbit, 3V)
      • MX25UM51245GXDIH0  (512 Mbit, 1.8V)
      • MX25UM51345GXDI00   (512 Mbit, 1.8V)
      • MX25UW51345GXDI00   (512 Mbit, 1.8V)
      • MX66LM1G45GXDI00     (1024 Mbit, 3V)
      • MX66UM1G45GXDI00    (1024 Mbit, 1.8V)
      • MX66UM2G45GXRI00    (2048 Mbit, 1.8V)

xSPI MBMC v3 support for Macronix OctaMCP

Status of Macronix OctaMCP device testing and qualification performed by SLL:

  • Macronix International Co., Ltd – OctaMCP:
    • Physical validation in process on Trenz board:
      • MX65L12A64AAXDI00    (512 Mbit NOR Flash, 64 PSRAM, 3V)
      • MX65U12A64AAXDI00   (512 Mbit NOR Flash, 64 PSRAM, 1.8V)

xSPI MBMC v3 support for Micron Xccela Flash

Status of Micron Xccela Flash device testing and qualification performed by SLL:

  • Micron – Xccela Flash:
    • Physically validated:
      • MT35XU01GBBA1G12 (1 Gbit, 1.8V) 
    • Physical validation in process on Trenz board:
      • MT35XL256ABA2G12 (256 Mbit, 3V)
      • MT35XL512ABA1G12 (512 Mbit, 3V)
      • MT35XU01GBBA2G12 (1 Gbit, 1.8V)
      • MT35XU02GCBA1G12 (2 Gbit, 1.8V)

xSPI MBMC v3 support for Winbond HyperRAM 1.0

Status of Winbond HyperRAM memory device testing and qualification performed by SLL:

  • Winbond –  HyperRAM 1.0
    • Physical validation in process on Trenz board:
      • W955D8MBY  (32 Mbit, 1.8V)

xSPI MBMC v3 support for Winbond HyperRAM 2.0

Status of Winbond HyperRAM memory device testing and qualification performed by SLL:

  • Winbond –  HyperRAM 2.0
    • Physically validated:
      • W957D8MFY (128 Mbit, 1.8V)
    • Physical validation in process on Trenz board:
      • W957D8MFY (128 Mbit, 1.8V)
      • W957A8MFY (128 Mbit, 3V)
    • Validated in the Simulator
      • W956D8MBYA5I (64 Mbit, 1.8V)
      • W956D8MBYA6I (64 Mbit, 1.8V)
      • W956A8MBYA5I (64 Mbit, 3.0V)
      • W956A8MBYA5I (64 Mbit, 3.0V)
    • Support available on customer request:
      • W955D8MBYA6I (32 Mbit, 1.8V)
      • W957D8MFYA5I (128 Mbit, 1.8V)
      • W957A8MFYA5I (128 Mbit, 3.0V)
      • W957A8MFYA6I (128 Mbit, 3.0V)

xSPI MBMC v3 support for Winbond OctalNAND

Status of Winbond OctalNAND compatible memory device testing and qualification performed by SLL:

  • Winbond –  OctalNAND
    • Physical validation in process on Trenz board:
      • W35N01JWTBIG (1 Gbit, 1.8V)
      • W35N02JWTBIG (2 Gbit, 1.8V)
    • Planned support:
      • W35N02JWTBIG (4 Gbit, 1.8V)

Contact SLL for information on many development board options for all these memory vendors xSPI memory devices: info@synaptic-labs.com