SLL's embedded software innovation has been recognised by our customers and partners. Major FPGA, memory, and development board makers now officially partner with SLL. This ensures SLL IP is validated on a wide range of physical devices. SLL customers are located in most geographical regions, and include Fortune Global 500's, government agencies, and SME's from USA and Canada to China.
xSPI Multiple Bus Memory Controller (xSPI-MBMC) IP v3
for HyperBus™ 1.0 and 2.0, OctaBus™, Xccela® Bus,
JEDEC® xSPI (JESD251) Profile 1.0 and Profile 2.0, …
Memory device support
SLL is GigaDevice’s partner
SLL is an Infineon Associated Partner
SLL is JSC’s partner
SLL is a Microchip (Microsemi) CompanionCore Partner
SLL is a Microchip (Microsemi) CompanionCore Partner
SLL is Trenz Electronic’s partner
SLL is Winbond’s partner
SLL collaborates closely with Macronix
SLL’s IP supports Xilinx FPGA devices
xSPI MBMC support for memory devices
SLL’s memory controller supports, and is physically qualified with, the broadest range of JEDEC xSPI Profile 1.0 and 2.0 and xSPI-like memory device variants in the market.
- Supports PSRAM (low power replacement for SDR, LPSDR, DDR and CellularRAM)
- Supports NOR Flash (for fast random read access and long term data retention)
- Support for NAND Flash coming soon (for low-cost per bit and largest storage capacities)
- Supports memory devices with x4, x8 and x16 data paths
- Supports mixing-and-matching memory types {PSRAM, PSRAM}, {NOR Flash, PSRAM}, {NOR Flash, NOR Flash} with the same data path width on shared pins
- Supports use of different bus protocols, such as {HyperBus 1.0, OctaBus}, {JEDEC xSPI Profile 1.0, HyperBus 2.0} on shared pins
- Use of selected x8 non-volatile devices for power on configuration of Intel Cyclone 10 LP in 1S-1S-1s mode, and high speed re-use of that memory device in 8D-8D-8D mode to reduce bill of materials and increase system performance
SLL’s xSPI MBMC supports the broadest range of memory vendors:
- Ensures both short term and long term availability of memory devices for your project
- The ability to source memory devices, from all major memory vendors, reduces your supply chain risk
In line with recommendations from major memory vendors, SLL strongly recommends that customers ensure that the most up-to-date product order codes and the latest die revisions are employed during each manufacturing run of your product to ensure lowest power and best system performance. Therefore, SLL does not support legacy memory devices in new product designs.
xSPI MBMC currently supports, or will very soon support:
- AP Memory® Xccela™ PSRAM, OctaRAM™ and QSPI DDR PSRAM
- Infineon® (Cypress®) HyperFlash™ 1.0
- Everspin® SPI Industrial STT-MRAM Persistent Memory (EM064LX)
- Gigadevice® NOR Flash (GD25X, GD25LX)
- Infineon® HyperRAM™ 2.0 with HyperBus™ Interface and HyperRAM™ 2.0 with Octal Interface
- Infineon® Semper™ Flash with HyperBus™ Interface and Semper™ Flash with Octal Interface
- Integrated Silicon Solution Inc.® (ISSI) HyperRAM™ 1.0 (Revision D dies or higher only), HyperRAM 1.0™ with inbuilt ECC and HyperFlash™ 1.0
- ISSI® x8 Octal RAM and Octal RAM with inbuilt ECC
- ISSI® x8 Octal Flash (NOR Flash)
- ISSI® x8 Octal MCP
- Jeju Semiconductor Corp® (JSC) OctaRAM™
- Macronix® OctaBus™ / OctaFlash™ (NOR Flash)
- Micron® Xccela™ Flash (NOR Flash)
- Winbond® HyperRAM™ 1.0, 2.0 and 3.0
- Winbond® OctalNAND for use with Linux (W35N01JW, W35N02JW, W35N04JW)
xSPI MBMC enables easy transition from HyperBus™ 1.0 to HyperBus™ 2.0.
SLL’s HyperBus™ 1.0 customers are already successfully employing 200 MHz HyperBus™ 2.0 devices at up to 200 MHz DDR in FPGA.
xSPI MBMC support for AP Memory Xccela PSRAM
Status of AP Memory IoT RAM (Xccela) device testing and qualification performed by SLL:
- AP Memory – IoT RAM (Xccela):
- Physically validated:
- APS1604M-DQRABA (x4, 16 Mbit, 1.8V)
- APS6408L‐OBx (x4, 64 Mbit, 1.8V)
- APS12808L-OBx (x8, 128 Mbit, 1.8V)
- Physically validated on Trenz board:
- APS1604M-DQRABA (x4, 16 Mbit, 1.8V)
- APS12808L-OBM-BA (x8, 128 Mbit, 1.8V)
- APS12808L-3OBM-BA (x8, 128 Mbit, 3V)
- APS25608N-OBM-BD (x8, 256 Mbit, 1.8V)
- APS256XXN-OBR-BG (x8, 256 Mbit, 1.8V)
- APS256XXN-OBR-BG (x16, 256 Mbit, 1.8V)
- APS51208N-OBR-BD (x8, 512 Mbit, 1.8V)
- Validated in simulator:
- APS6408L-3OBx (x8, 64 Mbit, 3V)
- APS12808L-3OB (x8, 128 Mbit, 3V)
- APS25608N-OBRx (x8, 256 Mbit, 1.8V)
- APS51208N-OBRx (x8, 512 Mbit, 1.8V)
- Validation planned:
- APS12804O-DQ-WA (x4, 128 Mbit, 1.8V)
- APS128XXN-OBR-BG (x8, 128 Mbit, 1.8V)
- APS128XXN-OBR-BG (x16, 128 Mbit, 1.8V)
- APS512XXN-OBR-BG (x8, 512 Mbit, 1.8V)
- APS512XXN-OBR-BG (x16, 512 Mbit, 1.8V)
- Physically validated:
xSPI MBMC support for AP Memory OctaRAM
Status of AP Memory IoT (OctaRAM) device testing and qualification performed by SLL:
- AP Memory – IoT (OctaRAM):
- Physically validated:
- APM6408L-OC (64 Mbit, 1.8V)
- APM6408L-3OC (64 Mbit, 3.0V)
- Physically validated on Trenz board:
- APS6408L-30C (64 Mbit, 3.0V)
- Validation pending:
- APS25608N‐OCx (256 Mbit, 1.8V)
- APS51208N‐OCx (512 Mbit, 1.8V)
- Physically validated:
xSPI MBMC support for Dialog Semiconductor Octal xSPI
Status of Dialog Semiconductor ® Octal xSPI Memory (EcoXIP) device testing and qualification performed by SLL:
- Dialog Semiconductor ® Octal xSPI Memory (EcoXIP) :
- Validation in process on Trenz board:
- ATXP032-CCUE-T (32 Mbit, 1.8V)
- ATXP128-CCUE-Y (128 Mbit, 1.8V)
- Validation in process on Trenz board:
xSPI MBMC support for GigaDevice
Status of GigaDevice® NOR Flash (GD25X, GD25LX) device testing and qualification performed by SLL:
- GigaDevice® – NOR Flash (GD25X, GD25LX) :
- Validation in process on Trenz board:
- GD25LX256EBIR (x8, 256 Mbit, 1.8V)
- GD25LX512MEBIRR (x8, 512 Mbit, 1.8V)
- GD55LX01GEBIRY (x8, 1024 Mbit, 1.8V)
- Validation pending in simulator
- GD55LX02GE (x8, 2048 Mbit, 1.8V)
- GD55LX512WE (x8, 512 Mbit, 1.8V)
- Validation in process on Trenz board:
xSPI MBMC v3 support for Infineon (Cypress) HyperFlash 1.0
Status of Infineon (Cypress) HyperFlash 1.0 device testing and qualification performed by SLL:
- Infineon (Cypress) Semiconductor Corporation – HYPERFLASH 1.0
- Physically validated:
- S26KS512SDPBHI020 / 6KS512SDPHIO2 (512 Mbit, 1.8V)
- Validated in the simulator:
- S26KS128S (128 Mbit, 1.8V)
- S26KL128S (128 Mbit, 3.0V)
- S26KL256S (256 Mbit, 1.8V)
- S26KL512S (256 Mbit, 3.0V)
- S26KS256S (512 Mbit, 1.8V)
- S26KS512S (512 Mbit, 3.0V)
- Physically validated:
SLL and Infineon recommend customers upgrade from HYPERFLASH 1.0 to the latest generation of these memory devices.
Click here to visit the xSPI MBMC IP page for Infineon’s latest generation of memory devices.
xSPI MBMC v3 support for Infineon (Cypress) HyperRAM 1.0
Status of Infineon (Cypress) branded HyperRAM 1.0 device testing performed by SLL:
- Infineon Technologies AG
- Physically tested:
- Validated in simulator:
- S27KS0641 ( 64 Mbit, 1.8V)
- S27KL0641 ( 64 Mbit, 3.0V)
- S70KS1281 (128 Mbit, 1.8V)
SLL and Infineon strongly recommend customers upgrade from HYPERRAM 1.0 to the latest generation of these memory devices.
Click here to visit the xSPI MBMC IP page for Infineon’s latest generation of memory devices.
xSPI MBMC v3 support for Infineon (Cypress) HyperMCP 1.0
HYPERMCP (Hyper Multiple Chip Package) devices embed a HYPERRAM 1.0 die and HYPERFLASH 1.0 die in the same BGA24 package to reduce board area.
Status of Infineon (Cypress) HYPERMCP 1.0 device testing performed by SLL:
- Infineon Technologies AG – HYPERMCP 1.0
- Physically tested:
- S71KS512SC0 / 1KS512SCOHV00 (512 Mbit HYPERFLASH 1.0, 64 Mbit HYPERRAM 1.0, 1.8V)
- Physically tested:
SLL and Infineon strongly recommend customers upgrade from HYPERBUS 1.0 to the latest generation of these memory devices.
Click here to visit the xSPI MBMC IP page for Infineon’s latest generation of memory devices.
xSPI MBMC support for Infineon SemperFlash with HyperBus Interface (HyperFlash 2.0)
Status of Infineon SemperFlash memory device testing and qualification performed by SLL:
- Infineon Technologies AG – Semper Flash with HyperBus Interface (HyperFlash 2.0)
- Physically validated:
- S26HS512TGABHI00 / 26HS512TAI00 (512 Megabit, 1.8V)
- Physical validation in process
- S26HL512TFPBHI01 / 26HL512TPIO1 (512 Megabit 3.0V)
- Physical validation in process on Trenz board:
- S26HL512TFPBHM010 (512 Megabit, 3V)
- S26HL01GTFPBHI030 (1 Gigabit, 3V)
- S26HS01GTGABHV030 (1 Gigabit, 1.8V)
- Physical qualification available on customer demand
- S26HS01GT (1 Gigabit, 1.8V)
- S26HL01GT (1 Gigabit, 3.0V)
- Physically validated:
xSPI MBMC support for Infineon SemperFlash with Octal Interface
Status of Infineon SemperFlash memory device testing and qualification performed by SLL:
- Infineon Technologies AG – Semper Flash with Octal Interface
- Physically validated:
- S26HS512TGABHI00 / 26HS512TAI00 (512 Megabit, 1.8V)
- Physical validation in process
- S26HL512TFPBHI01 / 26HL512TPIO1 (512 Megabit 3.0V)
- Physical validation in process on Trenz Board:
- S28HS512TGABHB010 (512 Mbit, 1.8V)
- S28HL01GTFPBHV030 ( 1 Gigabit, 3V)
- S28HS01GTFPBHI030 ( 1 Gigabit, 1.8V)
- Physical qualification available on customer demand
- S26HS01GT (1 Gigabit, 1.8V)
- S26HL01GT (1 Gigabit, 3.0V)
- Physically validated:
xSPI MBMC support for Infineon HyperRAM 2.0 with HyperBus Interface
Status of Infineon HYPERRAM 2.0 memory device testing and qualification performed by SLL:
- Infineon Technologies AG – HYPERRAM 2.0 with HyperBus Interface
- Physically validated:
- S27KS0642GABHI02 ES / 7KS0642GAHIO2 ES ( 64 Mbit, 1.8V)
- S70KS1282GABHI02 ES / 7KS1282GAHV02 ES (128 Mbit, 1.8V)
- Physically validated on Trenz board:
- S70KS1282GABHV020 (128 Mbit, 1.8V)
- Physical validation in process on Trenz board:
- S70KL1282GABHV020 (128 Mbit, 3V)
- Validated in simulator:
- Pending..
- Physically validated:
xSPI MBMC v3 support for Infineon HyperRAM 2.0 with Octal Interface
Status of Infineon HYPERRAM 2.0 memory device testing and qualification performed by SLL:
- Infineon Technologies AG – HYPERRAM 2.0 with Octal Interface
- Physically validated:
- Pending..
- Physical validation in process on Trenz board:
- S27KS0643GABHI020 ( 64 Mbit, 1.8V)
- S70KL1283GABHV020 (128 Mbit, 3V)
- S27KL128DPBHV020 (128 Mbit, 3V)
- Validated in simulator:
- Pending..
- Physically validated:
xSPI MBMC v3 support for ISSI HyperFlash 1.0
Status of ISSI HyperFlash 1.0 device testing and qualification performed by SLL:
- Integrated Silicon Solution Inc. (ISSI) – HyperFlash 1.0
- Physically validated:
- IS26KS256S (256 Mbit, 1.8V)
- IS26KS512S (512 Mbit, 1.8V)
- Validated in the simulator:
- Pending…
- Physically validated:
xSPI MBMC v3 support for ISSI HyperRAM 1.0
SLL’s Memory Controller is compatible with all HyperRAM 1.0 memory devices from ISSI. ISSI recommends customers always use the latest die Revision (currently Rev. D) of their HyperRAM product family.
Status of ISSI HyperRAM 1.0 memory device testing and qualification performed by SLL:
- Integrated Silicon Solution Inc. (ISSI) – HyperRAM 1.0
- Physically validated:
- IS66WVH8M8ALL-166 (x8, 64 Mbit, single die, 1.8V) – Not Recommended for new designs
- IS66WVH8M8DBLL-100 (x8, 64 Mbit, single die 3.0V) – Revision D Die
- Physical validation in process on Trenz board:
- IS66WVH16M8DALL-166A1LI (128 Mbit, single die, 1.8V) – Revision D Die
- IS66WVH16M8DBLL-100B1LI (128 Megabit, single die, 3.0V) – Revision D Die
- IS66WVH32M8DALL-166B1LI (256 Megabit, single die, 1.8V) – Revision D Die
- IS66WVH32M8DBLL-100B1LI (256 Megabit, single die, 3.0V) – Revision D Die
- Provisional support available on customer demand for Revision D dies
- IS66WVH16M8EDALL (128 Megabit, single die, 1.8V, Internal ECC)
- IS66WVH16M8EDBLL (128 Megabit, single die, 3.0V, Internal ECC)
- IS67WVH8M8DALL ( 64 Megabit, single die, 1.8V)
- IS67WVH8M8DBLL ( 64 Megabit, single die, 3.0V)
- IS67WVH16M8DALL (128 Megabit, single die, 1.8V)
- IS67WVH16M8DBLL (128 Megabit, single die, 3.0V)
- IS67WVH32M8DBLL (256 Megabit, single die, 3.0V)
- IS67WVH16M8EDALL (128 Megabit, single die, 1.8V, Internal ECC)
- IS67WVH16M8EDBLL (128 Megabit, single die, 3.0V, Internal ECC)
- Legacy devices
- IS66WVH8M8ALL/BLL (ISSI recommends all customers migrate to the supported newer single die IS66WVH8M8DALL/BLL)
- IS66WVH16M8ALL-166 (128 Mbit, dual die, 1.8V)
- ISSI 1643 IS66WVH16M8ALL-166B1LI N508 BNB589580YC
- ISSI 1806 IS66WVH16M8ALL-166B1L1 N508 BNN984000Y3
- ISSI 1938 IS66WVH16M8ALL-166B1LI N508 BNN984000Y3
- ISSI 1938 IS66WVH16M8ALL-166B1LI N508 BRN572000Y1
- IS66WVH16M8BLL-100 (128 Mbit, dual die, 3.0V)
- IS66WVH16M8ALL-166 (128 Mbit, dual die, 1.8V)
- IS67WVH8M8ALL/BLL (ISSI recommends all customers migrate to the supported newer single die IS67WVH8M8DALL/BLL)
- IS67WVH16M8ALL-166 (128 Mbit, dual die, 1.8V)
- IS67WVH16M8BLL-100 (128 Mbit, dual die, 3.0V)
- IS66WVH8M8ALL/BLL (ISSI recommends all customers migrate to the supported newer single die IS66WVH8M8DALL/BLL)
- Physically validated:
xSPI MBMC support for ISSI Octal Flash
Status of ISSI Octal Flash device testing and qualification performed by SLL:
- Integrated Silicon Solution Inc. (ISSI) – Octal Flash
- Physical validation in process on Trenz board:
- IS25LX256-JHLE (256 Mbit, 3V)
- IS25WX256-JHLE (256 Mbit, 1.8V)
- IS72WVO32M8AWO256-200HLA2 (256 Mbit Octal Flash, 64 Mbit Octal RAM, 1.8V)
- IS72WVO32M8BLO256-133HLA2 (256 Mbit Octal Flash, 64 Mbit Octal RAM, 3V)
- Support planned:
- IS25LX064
- IS25WX064
- IS25LX128
- IS25WX128
- IS25WX256
- IS25LX512M
- IS25WX512M
- Physical validation in process on Trenz board:
xSPI MBMC support for ISSI Octal RAM
Status of ISSI Octal RAM device testing and qualification performed by SLL:
- Integrated Silicon Solution Inc. (ISSI) – Octal RAM:
- Physical validation in process on Trenz board:
- IS66WVO16M8DALL-200BLI (128 Mbit, 1.8V)
- IS66WVO16M8DBLL-100BLI (128 Mbit, 3V)
- IS66WVO16M8DBLL-133BLI (128 Mbit, 3V)
- IS66WVO16M8EDALL-166BLI (128 Mbit, 1.8V, with ECC)
- IS66WVO16M8EDBLL-133BLI (128 Mbit, 3V, with ECC)
- IS66WVO32M8DALL-200BLI (256 Mbit, 1.8V)
- IS66WVO32M8DBLL-133BLI (256 Mbit, 3V)
- IS72WVO32M8AWO256-200HLA2 (256 Mbit Octal Flash, 256 Mbit Octal RAM, 1.8V)
- IS72WVO32M8BLO256-133HLA2 (256 Mbit Octal Flash, 256 Mbit Octal RAM, 3V)
- Support planned:
- IS67WVO16M8DALL
- IS67WVO16M8DBLL
- IS67WVO16M8EDALL (with ECC)
- IS67WVO16M8EDBLL (with ECC)
- IS67WVO32M8DALL
- IS67WVO32M8DBLL
- Physical validation in process on Trenz board:
xSPI MBMC support for ISSI Octal MCP
Status of ISSI Octal RAM device testing and qualification performed by SLL:
- Integrated Silicon Solution Inc. (ISSI) – Octal MCP:
- Physical validation in process on Trenz board:
- IS72WVO32M8AWO256-200HLA2 (256 Mbit Octal Flash, 256 Mbit Octal RAM, 1.8V)
- IS72WVO32M8BLO256-133HLA2 (256 Mbit Octal Flash, 256 Mbit Octal RAM, 3V)
- Physical validation in process on Trenz board:
xSPI MBMC support for JSC OctaRAM
Status of JSC OctaRAM device testing and qualification performed by SLL:
- Jeju Semiconductor Corp (JSC) – OctaRAM:
- Physically validated:
- JSC28SSP8AGDY-50I (128 Mbit, 1.8V)
- JSC64SSP8AGDY-50I (64 Mbit, 1.8V)
- Physical validation in process on Trenz board:
- JSC28SSP8AGDY-50I (128 Mbit, 1.8V)
- JSC64SSP8AGDY-50I (64 Mbit, 1.8V)
- JSC64SSP8AGDY-75I (64 Mbit, 3V)
- Validated in simulator:
- JSC28SSU8AGDY-75I (128 Mbit, 3V)
- JSC64SSU8AGDY-75I (64 Mbit, 3V)
- Physically validated:
xSPI MBMC support for Macronix OctaBus™
Status of Macronix OctaBus™ device testing and qualification performed by SLL:
- Macronix International Co., Ltd – OctaBus™:
- Physically validated on Trenz board:
- MX25UM512 (512 Mbit, 1.8V)
- Physical validation in process on Trenz board:
- MX25LM51245GXDI00 (512 Mbit, 3V)
- MX25UM51245GXDIH0 (512 Mbit, 1.8V)
- MX25UM51345GXDI00 (512 Mbit, 1.8V)
- MX25UW51345GXDI00 (512 Mbit, 1.8V)
- MX66LM1G45GXDI00 (1024 Mbit, 3V)
- MX66UM1G45GXDI00 (1024 Mbit, 1.8V)
- MX66UM2G45GXRI00 (2048 Mbit, 1.8V)
- Physically validated on Trenz board:
xSPI MBMC v3 support for Macronix OctaMCP™
Status of Macronix OctaMCP™ device testing and qualification performed by SLL:
- Macronix International Co., Ltd – OctaMCP™:
- Physically validated on Trenz board:
- MX65U12A64AAXDI00 (512 Mbit OctaBus™ NOR Flash, 64 Mbit PSRAM, 1.8V)
- Physical validation in process on Trenz board:
- MX65L12A64AAXDI00 (512 Mbit OctaBus™ NOR Flash, 64 Mbit PSRAM, 3V)
- Physically validated on Trenz board:
xSPI MBMC support for Micron Xccela Flash
Status of Micron Xccela Flash device testing and qualification performed by SLL:
- Micron – Xccela Flash:
- Physically validated:
- MT35XU01GBBA1G12 (1 Gbit, 1.8V)
- Physical validation in process on Trenz board:
- MT35XL256ABA2G12 (256 Mbit, 3V)
- MT35XL512ABA1G12 (512 Mbit, 3V)
- MT35XU01GBBA2G12 (1 Gbit, 1.8V)
- MT35XU02GCBA1G12 (2 Gbit, 1.8V)
- Physically validated:
xSPI MBMC v3 support for Winbond HyperRAM 1.0
Status of Winbond HyperRAM memory device testing and qualification performed by SLL:
- Winbond – HyperRAM 1.0
- Physical validation in process on Trenz board:
- W955D8MBY (32 Mbit, 1.8V)
- Physical validation in process on Trenz board:
xSPI MBMC v3 support for Winbond HyperRAM 2.0
Status of Winbond HyperRAM memory device testing and qualification performed by SLL:
- Winbond – HyperRAM 2.0
- Physically validated:
- W957D8MFY (128 Mbit, 1.8V)
- Physical validation in process on Trenz board:
- W957D8MFY (128 Mbit, 1.8V)
- W957A8MFY (128 Mbit, 3V)
- Validated in the Simulator
- W956D8MBYA5I (64 Mbit, 1.8V)
- W956D8MBYA6I (64 Mbit, 1.8V)
- W956A8MBYA5I (64 Mbit, 3.0V)
- W956A8MBYA5I (64 Mbit, 3.0V)
- Support available on customer request:
- W957D8MFYA5I (128 Mbit, 1.8V)
- W957A8MFYA5I (128 Mbit, 3.0V)
- W957A8MFYA6I (128 Mbit, 3.0V)
- Physically validated:
xSPI MBMC v3 support for Winbond OctalNAND
Status of Winbond OctalNAND compatible memory device testing and qualification performed by SLL:
- Winbond – OctalNAND
- Physical validation in process on Trenz board:
- W35N01JWTBIG (1 Gbit, 1.8V)
- W35N02JWTBIG (2 Gbit, 1.8V)
- Planned support:
- W35N02JWTBIG (4 Gbit, 1.8V)
- Physical validation in process on Trenz board:
Contact SLL for information on many development board options for all these memory vendors xSPI memory devices: info@synaptic-labs.com
