SLL's embedded software innovation has been recognised by our customers and partners. Major FPGA, memory, and development board makers now officially partner with SLL. This ensures SLL IP is validated on a wide range of physical devices. SLL customers are located in most geographical regions, and include Fortune Global 500's, government agencies, and SME's from USA and Canada to China.
xSPI MBMC support for AP Memory Xccela PSRAM
Status of AP Memory IoT RAM (Xccela) device testing and qualification performed by SLL:
- AP Memory – IoT RAM (Xccela):
- Physically validated:
- APS1604M-DQRABA (x4, 16 Mbit, 1.8V)
- APS6408L‐OBx (x4, 64 Mbit, 1.8V)
- APS12808L-OBx (x8, 128 Mbit, 1.8V)
- Physically validated on Trenz board:
- APS1604M-DQRABA (x4, 16 Mbit, 1.8V)
- APS12808L-OBM-BA (x8, 128 Mbit, 1.8V)
- APS12808L-3OBM-BA (x8, 128 Mbit, 3V)
- APS25608N-OBM-BD (x8, 256 Mbit, 1.8V)
- APS256XXN-OBR-BG (x8, 256 Mbit, 1.8V)
- APS256XXN-OBR-BG (x16, 256 Mbit, 1.8V)
- APS51208N-OBR-BD (x8, 512 Mbit, 1.8V)
- Validated in simulator:
- APS6408L-3OBx (x8, 64 Mbit, 3V)
- APS12808L-3OB (x8, 128 Mbit, 3V)
- APS25608N-OBRx (x8, 256 Mbit, 1.8V)
- APS51208N-OBRx (x8, 512 Mbit, 1.8V)
- Validation planned:
- APS12804O-DQ-WA (x4, 128 Mbit, 1.8V)
- APS128XXN-OBR-BG (x8, 128 Mbit, 1.8V)
- APS128XXN-OBR-BG (x16, 128 Mbit, 1.8V)
- APS512XXN-OBR-BG (x8, 512 Mbit, 1.8V)
- APS512XXN-OBR-BG (x16, 512 Mbit, 1.8V)
- Physically validated:
xSPI MBMC support for AP Memory OctaRAM
Status of AP Memory IoT (OctaRAM) device testing and qualification performed by SLL:
- AP Memory – IoT (OctaRAM):
- Physically validated:
- APM6408L-OC (64 Mbit, 1.8V)
- APM6408L-3OC (64 Mbit, 3.0V)
- Physically validated on Trenz board:
- APS6408L-30C (64 Mbit, 3.0V)
- Validation pending:
- APS25608N‐OCx (256 Mbit, 1.8V)
- APS51208N‐OCx (512 Mbit, 1.8V)
- Physically validated:
xSPI MBMC support for Dialog Semiconductor Octal xSPI
Status of Dialog Semiconductor ® Octal xSPI Memory (EcoXIP) device testing and qualification performed by SLL:
- Dialog Semiconductor ® Octal xSPI Memory (EcoXIP) :
- Validation in process on Trenz board:
- ATXP032-CCUE-T (32 Mbit, 1.8V)
- ATXP128-CCUE-Y (128 Mbit, 1.8V)
- Validation in process on Trenz board:
xSPI MBMC support for GigaDevice
Status of GigaDevice® NOR Flash (GD25X, GD25LX) device testing and qualification performed by SLL:
- GigaDevice® – NOR Flash (GD25X, GD25LX) :
- Validation in process on Trenz board:
- GD25LX256EBIR (x8, 256 Mbit, 1.8V)
- GD25LX512MEBIRR (x8, 512 Mbit, 1.8V)
- GD55LX01GEBIRY (x8, 1024 Mbit, 1.8V)
- Validation pending in simulator
- GD55LX02GE (x8, 2048 Mbit, 1.8V)
- GD55LX512WE (x8, 512 Mbit, 1.8V)
- Validation in process on Trenz board:
xSPI MBMC v3 support for Infineon (Cypress) HyperFlash 1.0
Status of Infineon (Cypress) HyperFlash 1.0 device testing and qualification performed by SLL:
- Infineon (Cypress) Semiconductor Corporation – HYPERFLASH 1.0
- Physically validated:
- S26KS512SDPBHI020 / 6KS512SDPHIO2 (512 Mbit, 1.8V)
- Validated in the simulator:
- S26KS128S (128 Mbit, 1.8V)
- S26KL128S (128 Mbit, 3.0V)
- S26KL256S (256 Mbit, 1.8V)
- S26KL512S (256 Mbit, 3.0V)
- S26KS256S (512 Mbit, 1.8V)
- S26KS512S (512 Mbit, 3.0V)
- Physically validated:
SLL and Infineon recommend customers upgrade from HYPERFLASH 1.0 to the latest generation of these memory devices.
Click here to visit the xSPI MBMC IP page for Infineon’s latest generation of memory devices.
xSPI MBMC v3 support for Infineon (Cypress) HyperRAM 1.0
Status of Infineon (Cypress) branded HyperRAM 1.0 device testing performed by SLL:
- Infineon Technologies AG
- Physically tested:
- Validated in simulator:
- S27KS0641 ( 64 Mbit, 1.8V)
- S27KL0641 ( 64 Mbit, 3.0V)
- S70KS1281 (128 Mbit, 1.8V)
SLL and Infineon strongly recommend customers upgrade from HYPERRAM 1.0 to the latest generation of these memory devices.
Click here to visit the xSPI MBMC IP page for Infineon’s latest generation of memory devices.
xSPI MBMC v3 support for Infineon (Cypress) HyperMCP 1.0
HYPERMCP (Hyper Multiple Chip Package) devices embed a HYPERRAM 1.0 die and HYPERFLASH 1.0 die in the same BGA24 package to reduce board area.
Status of Infineon (Cypress) HYPERMCP 1.0 device testing performed by SLL:
- Infineon Technologies AG – HYPERMCP 1.0
- Physically tested:
- S71KS512SC0 / 1KS512SCOHV00 (512 Mbit HYPERFLASH 1.0, 64 Mbit HYPERRAM 1.0, 1.8V)
- Physically tested:
SLL and Infineon strongly recommend customers upgrade from HYPERBUS 1.0 to the latest generation of these memory devices.
Click here to visit the xSPI MBMC IP page for Infineon’s latest generation of memory devices.
xSPI MBMC support for Infineon SemperFlash with HyperBus Interface (HyperFlash 2.0)
Status of Infineon SemperFlash memory device testing and qualification performed by SLL:
- Infineon Technologies AG – Semper Flash with HyperBus Interface (HyperFlash 2.0)
- Physically validated:
- S26HS512TGABHI00 / 26HS512TAI00 (512 Megabit, 1.8V)
- Physical validation in process
- S26HL512TFPBHI01 / 26HL512TPIO1 (512 Megabit 3.0V)
- Physical validation in process on Trenz board:
- S26HL512TFPBHM010 (512 Megabit, 3V)
- S26HL01GTFPBHI030 (1 Gigabit, 3V)
- S26HS01GTGABHV030 (1 Gigabit, 1.8V)
- Physical qualification available on customer demand
- S26HS01GT (1 Gigabit, 1.8V)
- S26HL01GT (1 Gigabit, 3.0V)
- Physically validated:
xSPI MBMC support for Infineon SemperFlash with Octal Interface
Status of Infineon SemperFlash memory device testing and qualification performed by SLL:
- Infineon Technologies AG – Semper Flash with Octal Interface
- Physically validated:
- S26HS512TGABHI00 / 26HS512TAI00 (512 Megabit, 1.8V)
- Physical validation in process
- S26HL512TFPBHI01 / 26HL512TPIO1 (512 Megabit 3.0V)
- Physical validation in process on Trenz Board:
- S28HS512TGABHB010 (512 Mbit, 1.8V)
- S28HL01GTFPBHV030 ( 1 Gigabit, 3V)
- S28HS01GTFPBHI030 ( 1 Gigabit, 1.8V)
- Physical qualification available on customer demand
- S26HS01GT (1 Gigabit, 1.8V)
- S26HL01GT (1 Gigabit, 3.0V)
- Physically validated:
xSPI MBMC v3 support for ISSI HyperFlash 1.0
Status of ISSI HyperFlash 1.0 device testing and qualification performed by SLL:
- Integrated Silicon Solution Inc. (ISSI) – HyperFlash 1.0
- Physically validated:
- IS26KS256S (256 Mbit, 1.8V)
- IS26KS512S (512 Mbit, 1.8V)
- Validated in the simulator:
- Pending…
- Physically validated:
xSPI MBMC v3 support for ISSI HyperRAM 1.0
SLL’s Memory Controller is compatible with all HyperRAM 1.0 memory devices from ISSI. ISSI recommends customers always use the latest die Revision (currently Rev. D) of their HyperRAM product family.
Status of ISSI HyperRAM 1.0 memory device testing and qualification performed by SLL:
- Integrated Silicon Solution Inc. (ISSI) – HyperRAM 1.0
- Physically validated:
- IS66WVH8M8ALL-166 (x8, 64 Mbit, single die, 1.8V) – Not Recommended for new designs
- IS66WVH8M8DBLL-100 (x8, 64 Mbit, single die 3.0V) – Revision D Die
- Physical validation in process on Trenz board:
- IS66WVH16M8DALL-166A1LI (128 Mbit, single die, 1.8V) – Revision D Die
- IS66WVH16M8DBLL-100B1LI (128 Megabit, single die, 3.0V) – Revision D Die
- IS66WVH32M8DALL-166B1LI (256 Megabit, single die, 1.8V) – Revision D Die
- IS66WVH32M8DBLL-100B1LI (256 Megabit, single die, 3.0V) – Revision D Die
- Provisional support available on customer demand for Revision D dies
- IS66WVH16M8EDALL (128 Megabit, single die, 1.8V, Internal ECC)
- IS66WVH16M8EDBLL (128 Megabit, single die, 3.0V, Internal ECC)
- IS67WVH8M8DALL ( 64 Megabit, single die, 1.8V)
- IS67WVH8M8DBLL ( 64 Megabit, single die, 3.0V)
- IS67WVH16M8DALL (128 Megabit, single die, 1.8V)
- IS67WVH16M8DBLL (128 Megabit, single die, 3.0V)
- IS67WVH32M8DBLL (256 Megabit, single die, 3.0V)
- IS67WVH16M8EDALL (128 Megabit, single die, 1.8V, Internal ECC)
- IS67WVH16M8EDBLL (128 Megabit, single die, 3.0V, Internal ECC)
- Legacy devices
- IS66WVH8M8ALL/BLL (ISSI recommends all customers migrate to the supported newer single die IS66WVH8M8DALL/BLL)
- IS66WVH16M8ALL-166 (128 Mbit, dual die, 1.8V)
- ISSI 1643 IS66WVH16M8ALL-166B1LI N508 BNB589580YC
- ISSI 1806 IS66WVH16M8ALL-166B1L1 N508 BNN984000Y3
- ISSI 1938 IS66WVH16M8ALL-166B1LI N508 BNN984000Y3
- ISSI 1938 IS66WVH16M8ALL-166B1LI N508 BRN572000Y1
- IS66WVH16M8BLL-100 (128 Mbit, dual die, 3.0V)
- IS66WVH16M8ALL-166 (128 Mbit, dual die, 1.8V)
- IS67WVH8M8ALL/BLL (ISSI recommends all customers migrate to the supported newer single die IS67WVH8M8DALL/BLL)
- IS67WVH16M8ALL-166 (128 Mbit, dual die, 1.8V)
- IS67WVH16M8BLL-100 (128 Mbit, dual die, 3.0V)
- IS66WVH8M8ALL/BLL (ISSI recommends all customers migrate to the supported newer single die IS66WVH8M8DALL/BLL)
- Physically validated:
xSPI MBMC support for ISSI Octal Flash
Status of ISSI Octal Flash device testing and qualification performed by SLL:
- Integrated Silicon Solution Inc. (ISSI) – Octal Flash
- Physical validation in process on Trenz board:
- IS25LX256-JHLE (256 Mbit, 3V)
- IS25WX256-JHLE (256 Mbit, 1.8V)
- IS72WVO32M8AWO256-200HLA2 (256 Mbit Octal Flash, 64 Mbit Octal RAM, 1.8V)
- IS72WVO32M8BLO256-133HLA2 (256 Mbit Octal Flash, 64 Mbit Octal RAM, 3V)
- Support planned:
- IS25LX064
- IS25WX064
- IS25LX128
- IS25WX128
- IS25WX256
- IS25LX512M
- IS25WX512M
- Physical validation in process on Trenz board:
xSPI MBMC support for ISSI Octal RAM
Status of ISSI Octal RAM device testing and qualification performed by SLL:
- Integrated Silicon Solution Inc. (ISSI) – Octal RAM:
- Physical validation in process on Trenz board:
- IS66WVO16M8DALL-200BLI (128 Mbit, 1.8V)
- IS66WVO16M8DBLL-100BLI (128 Mbit, 3V)
- IS66WVO16M8DBLL-133BLI (128 Mbit, 3V)
- IS66WVO16M8EDALL-166BLI (128 Mbit, 1.8V, with ECC)
- IS66WVO16M8EDBLL-133BLI (128 Mbit, 3V, with ECC)
- IS66WVO32M8DALL-200BLI (256 Mbit, 1.8V)
- IS66WVO32M8DBLL-133BLI (256 Mbit, 3V)
- IS72WVO32M8AWO256-200HLA2 (256 Mbit Octal Flash, 256 Mbit Octal RAM, 1.8V)
- IS72WVO32M8BLO256-133HLA2 (256 Mbit Octal Flash, 256 Mbit Octal RAM, 3V)
- Support planned:
- IS67WVO16M8DALL
- IS67WVO16M8DBLL
- IS67WVO16M8EDALL (with ECC)
- IS67WVO16M8EDBLL (with ECC)
- IS67WVO32M8DALL
- IS67WVO32M8DBLL
- Physical validation in process on Trenz board:
xSPI MBMC support for ISSI Octal MCP
Status of ISSI Octal RAM device testing and qualification performed by SLL:
- Integrated Silicon Solution Inc. (ISSI) – Octal MCP:
- Physical validation in process on Trenz board:
- IS72WVO32M8AWO256-200HLA2 (256 Mbit Octal Flash, 256 Mbit Octal RAM, 1.8V)
- IS72WVO32M8BLO256-133HLA2 (256 Mbit Octal Flash, 256 Mbit Octal RAM, 3V)
- Physical validation in process on Trenz board:
xSPI MBMC support for JSC OctaRAM
Status of JSC OctaRAM device testing and qualification performed by SLL:
- Jeju Semiconductor Corp (JSC) – OctaRAM:
- Physically validated:
- JSC28SSP8AGDY-50I (128 Mbit, 1.8V)
- JSC64SSP8AGDY-50I (64 Mbit, 1.8V)
- Physical validation in process on Trenz board:
- JSC28SSP8AGDY-50I (128 Mbit, 1.8V)
- JSC64SSP8AGDY-50I (64 Mbit, 1.8V)
- JSC64SSP8AGDY-75I (64 Mbit, 3V)
- Validated in simulator:
- JSC28SSU8AGDY-75I (128 Mbit, 3V)
- JSC64SSU8AGDY-75I (64 Mbit, 3V)
- Physically validated:
xSPI MBMC support for Macronix OctaBus™
Status of Macronix OctaBus™ device testing and qualification performed by SLL:
- Macronix International Co., Ltd – OctaBus™:
- Physically validated on Trenz board:
- MX25UM512 (512 Mbit, 1.8V)
- Physical validation in process on Trenz board:
- MX25LM51245GXDI00 (512 Mbit, 3V)
- MX25UM51245GXDIH0 (512 Mbit, 1.8V)
- MX25UM51345GXDI00 (512 Mbit, 1.8V)
- MX25UW51345GXDI00 (512 Mbit, 1.8V)
- MX66LM1G45GXDI00 (1024 Mbit, 3V)
- MX66UM1G45GXDI00 (1024 Mbit, 1.8V)
- MX66UM2G45GXRI00 (2048 Mbit, 1.8V)
- Physically validated on Trenz board:
SLL xSPI MBMC support for Trenz Electronic Base Boards
Status of board testing and qualification performed by SLL with SLL’s xSPI MBMC memory controller:
- Trenz Electronic GmbH
- Cyclone 10 LP RefKit 10CL055 Development Board (TEI0009-02-055-8CA) – Validated
- S7 Mini – Fully Open-Source Module with Xilinx Spartan-7 7S25 + 64 MBit HyperRAM (TE0890-01-25-1C) – Validated
- Artix-7 100T FPGA Module with Xilinx XC7A100T-2CSG324I (TE0725-03-100-2I9) – Validated
- ZedBoard Zynq-7000 ARM/FPGA SoC Development Board with a proprietary FMC HyperBus board – Validated
- FPGA Module with Xilinx Artix-7 100T (TE0725LP-01-100-2L) – Pending
- Trenz Electronic CRUVI – MAX 10 (CR00101) – Validated
- Trenz Electronic CRUV – Cyclone 10 LP – Ref Kit ( CR00109-01 ) with a wide range of xSPI devices – Pending
- Trenz Electronic 4 x 5 Module Carrier for CRUVI Extension Boards (TEB0707) has been validated with a wide range of xSPI devices using the following SoM
- FPGA Module with Xilinx Artix-7 XC7A200T-2FBG484C, 1 GByte DDR3L – Validated
- MPSoC Module with Xilinx Zynq UltraScale+ ZU3CG-1E, 2 GByte DDR4 SDRAM (TE0820-04-3AE21FA) – Validated
- MPSoC Module with Xilinx Zynq UltraScale+ ZU2CG-1E, 4 GByte DDR4 SDRAM (AM0010-01-2AE21MA) – Pending
xSPI MBMC v3 support for Macronix OctaMCP™
Status of Macronix OctaMCP™ device testing and qualification performed by SLL:
- Macronix International Co., Ltd – OctaMCP™:
- Physically validated on Trenz board:
- MX65U12A64AAXDI00 (512 Mbit OctaBus™ NOR Flash, 64 Mbit PSRAM, 1.8V)
- Physical validation in process on Trenz board:
- MX65L12A64AAXDI00 (512 Mbit OctaBus™ NOR Flash, 64 Mbit PSRAM, 3V)
- Physically validated on Trenz board:
SLL xSPI MBMC support for Trenz Electronic Memory Boards
Status of board testing and qualification performed by SLL with SLL’s xSPI MBMC memory controller:
- Trenz Electronic GmbH
- AP Memory – Xccela PSRAM (x4, x8, x16)
- APS1604M-DQRABA (x4, 16 Mbit, 1.8V) – Pending
- APS12808L-OBM-BA (x8, 128 Mbit, 1.8V) – Pending
- APS12808L-3OBM-BA (x8, 128 Mbit, 3V) – Pending
- APS25608N-OBR-BD (x8, 256 Mbit, 1.8V) – Pending
- APS256XXN-OBR-BG (x8, 256 Mbit, 1.8V) – Pending
- APS256XXN-OBR-BG (x16, 256 Mbit, 1.8V) – Pending
- APS51208N-OBR-BD (x8, 512 Mbit, 1.8V) – Pending
- Cypress Semiconductor Corporation – Semper Flash with HyperBus Interface (HyperFlash 2.0)
- S26HL512TFPBHM010 (512 Megabit, 3V) – Pending
- S26HL01GTFPBHI030 (1 Gigabit, 3V) – Pending
- S26HS01GTGABHV030 (1 Gigabit, 1.8V) – Pending
- Cypress Semiconductor Corporation – Semper Flash with Octal Interface
- S28HS512TGABHB010 (512 Mbit, 1.8V) – Pending
- S28HL01GTFPBHV030 ( 1 Gigabit, 3V) – Pending
- S28HS01GTFPBHI030 ( 1 Gigabit, 1.8V) – Pending
- Cypress Semiconductor Corporation – HyperRAM 2.0 with HyperBus Interface
- S70KL1282GABHV020 (128 Mbit, 3V) – Pending
- S70KS1282GABHV020 (128 Mbit, 1.8V) – Pending
- Cypress Semiconductor Corporation – HyperRAM 2.0 with Octal Interface
- S27KS0643GABHI020 ( 64 Mbit 1.8V) – Pending
- S70KL1283GABHV020 (128 Mbit, 3V) – Pending
- S27KL128DPBHV020 (128 Mbit 3V) – Pending
- Dialog Semiconductor ® Octal xSPI Memory (EcoXIP):
- ATXP032-CCUE-T (32 Mbit, 1.8V)
- ATXP128-CCUE-Y (128 Mbit, 1.8V)
- Gigadevice® – NOR Flash (GD25X, GD25LX) :
- GD25LX256EBIR (x8, 256 Mbit, 1.8V) – Pending
- GD25LX512MEBIRR (x8, 512 Mbit, 1.8V) – Pending
- GD55LX01GEBIRY (x8, 1024 Mbit, 1.8V) – Pending
- Integrated Silicon Solution Inc. (ISSI) – HyperRAM 1.0
- IS66WVH16M8DALL-166B1LI (128 Mbit, dual die, 1.8V) – Pending
- IS66WVH16M8DBLL-100B1LI (128 Megabit, single die, 3.0V) – Pending
- IS66WVH32M8DALL-166B1LI (256 Megabit, single die, 1.8V) – Pending
- IS66WVH32M8DBLL-100B1LI (256 Megabit, single die, 3.0V) – Pending
- Integrated Silicon Solution Inc. (ISSI) – OctalRAM:
- IS66WVO16M8DALL-200BLI (128 Mbit, 1.8V) – Pending
- IS66WVO16M8DBLL-100BLI (128 Mbit, 3V) – Pending
- IS66WVO16M8DBLL-133BLI (128 Mbit, 3V) – Pending
- IS66WVO16M8EDALL-166BLI (128 Mbit, 1.8V, with ECC) – Pending
- IS66WVO16M8EDBLL-133BLI (128 Mbit, 3V, with ECC) – Pending
- IS66WVO32M8DALL-200BLI (256 Mbit, 1.8V) – Pending
- IS66WVO32M8DBLL-133BLI (256 Mbit, 3V) – Pending
- Integrated Silicon Solution Inc. (ISSI) – Octal MCP:
- IS72WVO32M8AWO256-200HLA2 (256 Mbit OctaFlash, 256 Mbit OctalRAM, 1.8V) – Pending
- IS72WVO32M8BLO256-133HLA2 (256 Mbit OctaFlash, 256 Mbit OctalRAM, 3V) – Pending
- Jeju Semiconductor Corp (JSC) – OctaRAM:
- JSC28SSP8AGDY-50I (128 Mbit, 1.8V) – Pending
- JSC64SSP8AGDY-50I (64 Mbit, 1.8V) – Pending
- JSC64SSP8AGDY-75I (64 Mbit, 3V) – Pending
- Macronix International Co., Ltd – OctaBus™:
- MX25LM51245GXDI00 (512 Mbit, 3V) – Pending
- MX25UM51245GXDIH0 (512 Mbit, 1.8V) – Pending
- MX25UM51345GXDI00 (512 Mbit, 1.8V) – Pending
- MX25UW51345GXDI00 (512 Mbit, 1.8V) – Pending
- MX66LM1G45GXDI00 (1024 Mbit, 3V) – Pending
- MX66UM1G45GXDI00 (1024 Mbit, 1.8V) – Pending
- MX66UM2G45GXRI00 (2048 Mbit, 1.8V) – Pending
- Macronix International Co., Ltd – OctaMCP:
- MX65L12A64AAXDI00 (512 Mbit NOR Flash, 64 PSRAM, 3V) – Pending
- MX65U12A64AAXDI00 (512 Mbit NOR Flash, 64 PSRAM, 1.8V) – Pending
- Micron – Xccela Flash:
- MT35XL256ABA2G12 (256 Mbit, 3V) – Pending
- MT35XL512ABA1G12 (512 Mbit, 3V) – Pending
- MT35XU01GBBA2G12 (1 Gbit, 1.8V) – Pending
- MT35XU02GCBA1G12 (2 Gbit, 1.8V) – Pending
- Winbond – HyperRAM 1.0
- W955D8MBY (32 Mbit, 1.8V) – Pending
- Winbond – HyperRAM 2.0
- W957D8MFY (128 Mbit, 1.8V) – Pending
- W957A8MFY (128 Mbit, 3V) – Pending
- Winbond – OctalNAND
- W35N01JWTBIG (1 Gbit, 1.8V) – Pending
- W35N02JWTBIG (2 Gbit, 1.8V) – Pending
- AP Memory – Xccela PSRAM (x4, x8, x16)
xSPI MBMC support for Micron Xccela Flash
Status of Micron Xccela Flash device testing and qualification performed by SLL:
- Micron – Xccela Flash:
- Physically validated:
- MT35XU01GBBA1G12 (1 Gbit, 1.8V)
- Physical validation in process on Trenz board:
- MT35XL256ABA2G12 (256 Mbit, 3V)
- MT35XL512ABA1G12 (512 Mbit, 3V)
- MT35XU01GBBA2G12 (1 Gbit, 1.8V)
- MT35XU02GCBA1G12 (2 Gbit, 1.8V)
- Physically validated:
SLL xSPI MBMC support for Aries Embedded Boards
Status of board testing and qualification performed by SLL with SLL’s xSPI MBMC memory controller:
- Aries Embeded GmbH
- MCXL-H055BBB-I ( Intel Cyclone 10 LP SoM with dual-channel HyperBus with MCXL Baseboard ) – Validated
- MCXLEVK-HO55BBB-I ( Intel Cyclone 10 LP SoM with dual-channel HyperBus and MCXLEVK Baseboard with dual-channel HyperBus ) – Preliminary validation
- MCXLEVK-HO55BBB-I ( Intel Cyclone 10 LP SoM and MCXLEVK Baseboard ) hand modified:
- Repopulated with 4 channels of AP Memory Xccela PSRAM – Pending
- Repopulated with a broad range of Cypress Devices – Pending
xSPI MBMC v3 support for Winbond HyperRAM 1.0
Status of Winbond HyperRAM memory device testing and qualification performed by SLL:
- Winbond – HyperRAM 1.0
- Physical validation in process on Trenz board:
- W955D8MBY (32 Mbit, 1.8V)
- Physical validation in process on Trenz board:
xSPI MBMC v3 support for Winbond HyperRAM 2.0
Status of Winbond HyperRAM memory device testing and qualification performed by SLL:
- Winbond – HyperRAM 2.0
- Physically validated:
- W957D8MFY (128 Mbit, 1.8V)
- Physical validation in process on Trenz board:
- W957D8MFY (128 Mbit, 1.8V)
- W957A8MFY (128 Mbit, 3V)
- Validated in the Simulator
- W956D8MBYA5I (64 Mbit, 1.8V)
- W956D8MBYA6I (64 Mbit, 1.8V)
- W956A8MBYA5I (64 Mbit, 3.0V)
- W956A8MBYA5I (64 Mbit, 3.0V)
- Support available on customer request:
- W957D8MFYA5I (128 Mbit, 1.8V)
- W957A8MFYA5I (128 Mbit, 3.0V)
- W957A8MFYA6I (128 Mbit, 3.0V)
- Physically validated:
SLL xSPI MBMC support for Critical Link boards
SLL has received some proprietary boards that SLL uses for development and testing purposes to support Critical Link.
Status of board testing and qualification performed by SLL with SLL’s xSPI MBMC memory controller:
- Critical Link, LLC
- Multiple Cyclone 10 GX SoM populated with ISSI HyperRAM @ 166 MHz – Validated
- Multiple Cyclone 10 GX SoM populated with AP Memory Xccela PSRAM @ 200 MHz – Pending
xSPI MBMC v3 support for Winbond OctalNAND
Status of Winbond OctalNAND compatible memory device testing and qualification performed by SLL:
- Winbond – OctalNAND
- Physical validation in process on Trenz board:
- W35N01JWTBIG (1 Gbit, 1.8V)
- W35N02JWTBIG (2 Gbit, 1.8V)
- Planned support:
- W35N02JWTBIG (4 Gbit, 1.8V)
- Physical validation in process on Trenz board:
SLL xSPI MBMC support for Devboards GmbH's Boards
Status of board testing and qualification performed by SLL with SLL’s xSPI MBMC memory controller:
- devboards GmbH
- HyperMAX 25 Development Kit – Validated
- HyperMAX 50 Development Kit – Validated
- DBM-SoC1-Base1 with DBM-SoC1-A2 (Cyclone V SoC SE) with proprietary memory boards, each memory board populated with 4 xSPI channels, 2 memory devices per xSPI channel:
- Populated with AP Memory Xccela PSRAM – Pending
- Populated with Cypress HyperRAM – Pending
- Populated with Cypress HyperFlash – Pending
- Populated with ISSI HyperRAM – Pending
SLL xSPI MBMC support for Digilent boards
Status of board testing and qualification performed by SLL with SLL’s xSPI MBMC memory controller:
- Digilent, Inc.
- Digilent Nexys 4 Artix-7 FPGA Trainer Board with several proprietary Pmod memory boards – Pending
- Digilent Arty S7-50: Spartan-7 FPGA for Makers and Hobbyists with several proprietary Pmod memory boards – Pending
SLL xSPI MBMC support for Intel boards
Status of board testing and qualification performed by SLL with SLL’s xSPI MBMC memory controller:
- Intel Corporation
- Cyclone 10 LP Evaluation Kit – Validated
- Multiple Cyclone 10 LP Evaluation Kits hand modified with AP Memory Xccela PSRAM – Validated
- Multiple Cyclone 10 LP Evaluation Kits hand modified with AP Memory OctaRAM – Pending
- Multiple Cyclone 10 LP Evaluation Kits hand modified with JSC OctaRAM – Validated
- MAX® 10 FPGA 10M50 Evaluation Kit
- connected to a proprietary Pmod memory board – Validated
- Cyclone 10 LP Evaluation Kit – Validated
SLL xSPI MBMC support for Microchip (Microsemi) boards
Status of board testing and qualification performed by SLL with SLL’s xSPI MBMC memory controller:
- Microchip Technology Inc
- PolarFire FPGA Video and Imaging Kit (MPF300-VIDEO-KIT):
- With a FMC memory board populated with HyperMCP and HyperRAM – Preliminary validation
- PolarFire FPGA Evaluation Kit (MPF300TS-1FCG1152I)
- With a proprietary FMC memory board – Pending
- PolarFire FPGA Video and Imaging Kit (MPF300-VIDEO-KIT):
